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Key Characteristics & Specifications
- Dielectric Constant (DK): Typically ranges between and, though specialized formulations can go up to. It maintains stable DK values even at high GHz frequencies.
- Loss Tangent: Extremely low, which ensures minimal signal degradation in high-speed or long-distance data transmission paths.
- Dielectric Material: Core substrate is Polytetrafluoroethylene (PTFE) combined with woven fiberglass (F4B) or nano-ceramic films (F4BTM/F4BM series) to improve mechanical strength.
- Thickness Range: Standard available board thicknesses generally range from to.
- Copper Cladding: Available in standard half-ounce, 1-ounce, and 2-ounce weights.
Advantages
- Superior High-Frequency Performance: Outperforms FR-4 in RF, radar, satellite communication, and antenna designs where signal integrity is paramount.
- Cost-Effective RF Solution: Often acts as a highly affordable and reliable domestic Chinese alternative to premium RF materials like Rogers.
- Thermal & Chemical Stability: Highly resistant to chemicals and maintains integrity in harsh operating environments.
Disadvantages & Fabrication Challenges
- Poor Rigidity: Raw PTFE is quite soft. While fiberglass/ceramic filling helps, the board remains less rigid than standard fiberglass.
- Adhesion Difficulties: PTFE has a notoriously low surface energy, making it difficult for copper foil to adhere. Manufacturers must use chemical or plasma etching on the Teflon to roughen the surface and create a strong bond with the copper.
- Dimensional Stability: The coefficient of thermal expansion (CTE) is generally higher than FR-4, which can make multilayer alignments and complex multi-step soldering processes more difficult.
Common Applications
- Antennas (e.g., GPS, Wi-Fi, and radar patches)
- Power amplifiers and splitters
- Aerospace and satellite communication systems
- Automotive collision-avoidance radar sensors
For technical data sheets, stack-up planning, or manufacturing capabilities, you can review detailed specifications and fabrication resources on industry platforms such as iPCB or Bicheng PCB.
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