Search Results

Any time

Custom range...

All results

Advanced Search

About 98 results (0.31s)

AI Overview

AlN-to-AlN direct bonding enables void-free, high-strength joining of aluminum nitride surfaces without intermediate adhesives, often using surface activation (plasma) followed by low-temperature annealing (

is less than 150 raised to the composed with power C

300 raised to the composed with power C

) to create an interface, frequently resulting in a thin

cap A l sub 2 cap O sub 3

transition layer that provides excellent thermal conductivity.

Key Aspects of AlN-AlN Direct Bonding:

Process Overview: The process generally involves cleaning (RCA method), plasma activation (O
$sub 2$
or N
$sub 2$
) to create a hydrophilic, high-energy surface, followed by clamping and annealing to strengthen the bond.
Low-Temperature Bonding: Bonding can be achieved at temperatures
$is less than 150 raised to the composed with power C$
through a low-temperature, rough-surface approach where plasma activation creates an
layer that converts to
$cap A l sub 2 cap O sub 3$
during annealing.
Bond Quality: Successful bonding achieves void-free interfaces with high bonding strengths (e.g.,
).
Thermal Advantages: This technique provides superior thermal management compared to adhesive bonding, often used for improving thermal conductivity in electronics by directly bonding AlN substrates.
Alternative Techniques: Direct bonded aluminum (DBA) onto AlN is also achieved using a transient liquid phase (e.g., Al-Si or Al-Ge alloys) to form a strong metal-ceramic interface.

AlN-AlN Layer Bonding and Its Thermal Characteristics
Apr 24, 2015 — In this paper, the AlN-AlN direct bonding is investigated to determine its elemental composition and bonding quality as well as to...
IOPscience
Low-temperature rough-surface wafer bonding with aluminum nitride ...
Aluminum Nitride to Aluminum Nitride Direct Wafer Bonding
Sep 15, 2018 — Introduction. A method was developed for the direct wafer-to-wafer bonding of aluminum nitride (AlN) to AlN-coated wafers. Direct ...
apps.dtic.mil

AI can make mistakes, so double-check responses

Web results

Aluminum Nitride to Aluminum Nitride Direct Wafer Bonding

dtic.mil

https://apps.dtic.mil › sti › pdfs

dtic.mil

https://apps.dtic.mil › sti › pdfs

PDF

by KA Olver2018Cited by 4 — The goal of the program was to directly bond a Metal Organic Chemical Vapor Deposition. (MOCVD)-grown, semipolar, 369.5-nm-wavelength InGaN/AlGaN multiple.Read more

17 pages

AlN-AlN Layer Bonding and Its Thermal Characteristics

IOPscience

https://iopscience.iop.org › article

IOPscience

https://iopscience.iop.org › article

by S Bao2015Cited by 21 — It provides a possibility to fabricate bonded wafers with enhanced thermal conductivity through room temperature AlN-AlN direct bonding. Its ...Read more

Direct bonded aluminum on aluminum nitride substrates ...

IEEE

https://ieeexplore.ieee.org › document

IEEE

https://ieeexplore.ieee.org › document

by Y Kuromitsu2010Cited by 11 — A new bonding process has been developed for producing direct bonded aluminum (DBA) substrates using aluminum nitride (AlN).Read more

AlN-AlN Layer Bonding and Its Thermal Characteristics

DSpace@MIT

https://dspace.mit.edu › handle

DSpace@MIT

https://dspace.mit.edu › handle

by S Bao2015Cited by 21 — It is concluded that this AlN-AlN bonded wafer pairs can exhibit a better heat dissipation capability than other bonded counterparts. Date issued. 2015-04. URI.Read more

Aluminum Nitride to Silicon Direct Bonding for an Alternative ...

ACS Publications

https://pubs.acs.org › doi

ACS Publications

https://pubs.acs.org › doi

Aug 4, 2021 — This work proposes using AlN as an alternative SOI structure due to several inherent material property advantages as well as functional advantages.Read more

Introduction

Results

Discussion

Supporting Information

1730 AlN-AlN Wafer Bonding and Its Thermal Characteristics

The Conference Exchange

https://ecs.confex.com › ecs › webprogram › Paper38693

The Conference Exchange

https://ecs.confex.com › ecs › webprogram › Paper38693

It shows the possibility of fabricating bonded wafer with enhanced thermal conductivity through room temperature AlN-AlN fusion bonding.Read more

Low-Cost Direct Bonded Aluminum (DBA) Substrates

Department of Energy (.gov)

https://www.energy.gov › pm036_lin_2013_o

Department of Energy (.gov)

https://www.energy.gov › pm036_lin_2013_o

PDF

Develop low-cost, high quality, and thermomechanically robust direct-bonded aluminum (DBA) substrates. ➢ Use ORNL's in-house unique processing capabilities ...Read more

21 pages

Room temperature bonding of aluminum nitride ceramic ...

ScienceDirect.com

https://www.sciencedirect.com › article › abs › pii

ScienceDirect.com

https://www.sciencedirect.com › article › abs › pii

by T Matsumae2020Cited by 27 — For efficient heat dissipation, Bao et al. demonstrated the direct bonding of AlN surfaces [9]. The sputter-cleaned AlN surfaces were contacted with each other ...Read more

Ceramic Aluminum Nitride Direct Wafer Bonding

Fujian Huaqing Electronic Material Technology Co.,Ltd

https://www.huaqingcn.com › ceramic-aluminum-nitride...

Fujian Huaqing Electronic Material Technology Co.,Ltd

https://www.huaqingcn.com › ceramic-aluminum-nitride...

There is a method was developed for the direct wafer-to-wafer bonding of aluminum nitride(AlN) to AlN-coated wafers.Direct wafer bonding requires smooth, flat, ...Read more

Direct bond copper DBC aluminum nitride AlN substrates

Valley Design

https://valleydesign.com › Landing Domains

Valley Design

https://valleydesign.com › Landing Domains

DBC is a process where solid Copper foil is bonded to AlN substrate at a high temperature in an inert atmosphere.Read more

Scholarly articles for AlN to AlN direct bonding
Direct bonding of copper to aluminum nitride - ‎Entezarian - Cited by 101 … and reliabilities of two types of AlN direct bonding … - ‎Wei - Cited by 33 Aluminum Nitride to silicon direct bonding for an … - ‎Kaaos - Cited by 14

Search Results

Web results

Aluminum Nitride to Aluminum Nitride Direct Wafer Bonding

AlN-AlN Layer Bonding and Its Thermal Characteristics

Direct bonded aluminum on aluminum nitride substrates ...

AlN-AlN Layer Bonding and Its Thermal Characteristics

Aluminum Nitride to Silicon Direct Bonding for an Alternative ...

1730 AlN-AlN Wafer Bonding and Its Thermal Characteristics

Low-Cost Direct Bonded Aluminum (DBA) Substrates

Room temperature bonding of aluminum nitride ceramic ...

Ceramic Aluminum Nitride Direct Wafer Bonding

Direct bond copper DBC aluminum nitride AlN substrates

Scholarly articles for AlN to AlN direct bonding

Page Navigation

Footer Links