Jun 1, 2021 — Ultraviolet laser cutting solar cell silicon wafers has high repeatability, stable work and fast speed As the "main force" of the global new ...

Semiconductor Laser Marking. We provide custom-designed, automated solutions for fast and precise ultraviolet laser labeling of IC mold compounds and ceramics.

Ultraviolet laser cut is the optimal option for large or small manufacturing as well as PCB depaneling, especially for flexible or rigid-flex circuit board.

UV Laser is suitable for rigid, flexible and rigid&flexible substrate cutting and marking, like FR4 substrates and imitation resin-based materials.

Laser cleaning with pulsed ultraviolet and infrared lasers is successfully employed to remove particulate contamination from silicon wafer surfaces and from ...

Jun 24, 2022 — UV lasers have the ability to reduce a complete hole process step to a single laser step, especially eliminating the need for de-drilling or ...

by JR Vig · 1992 · Cited by 50 — The ultraviolet (UV)/ozone surface-cleaning method, which is reviewed in this report, is an effective method of removing a variety of contaminants from silicon ...

Plating and Coating IC Chip Removal​​ KEYENCE's 3-Axis laser markers can mark the top surface of IC chips and remove plating or coatings within the same process. ...

Laser cleaning, a form of laser ablation, is a method of removing a selective layer of material from a surface using laser energy.

Excimer Laser​​ Excimer lasers are deep ultraviolet lasers with a 126 nm to 351 nm wavelength . These semiconductor lasers are used for polymer micro-processing. ...